BS EN 60749-22-2003 半导体器件.机械和气候试验方法.粘接强度
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【英文标准名称】:Semiconductordevices-Mechanicalandclimatictestmethods-Bondstrength
【原文标准名称】:半导体器件.机械和气候试验方法.粘接强度
【标准号】:BSEN60749-22-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-07-04
【实施或试行日期】:2003-07-04
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:机械试验;电气工程;电子设备及元件;电子工程;试验;粘结强度;半导体;元部件;环境试验;半导体器件;气候试验;集成电路
【英文主题词】:
【摘要】:ThispartofIEC60749isapplicabletosemiconductordevices(discretedevicesandintegratedcircuits).Theobjectofthispartistomeasurebondstrengthordeterminecompliancewithspecifiedbondstrengthrequirements.NOTEThistestisidenticaltothetestmethodcontainedinclause6ofchapter2ofIEC60749(1996),amendment1,apartfromchangestothisclauseandrenumbering.1GeneraldescriptionofthetestSeventestmethodsaredescribed,eachhavingitsownpurpose,thatis:-methodsAandBareintendedfortestinginternalbondsofadevicebyadirectpullingoftheconnectingwire;-methodCisintendedforbondsexternaltothedeviceandconsistsofapeelingstressexertedbetweentheleadorterminalandtheboardorsubstrate;-methodDisintendedforinternalbondsandconsistsofashearstressappliedbetweenadieandasubstrateorsimilarface-bondedconfigurations;-methodsEandFareintendedforexternalbondsandconsistofapush-offorapull-offstressexertedbetweenadieandthesubstrate;-methodGisintendedtotestthemechanicalresistanceofwirebondstoashearforce.2Descriptionofthetestapparatus(forallmethods)Theapparatusforthistestshouldconsistofsuitableequipmentforapplyingthespecifiedstressonthebond,leadwireorterminalsasrequiredinthespecifiedtestmethod.Acalibratedmeasurementandindicationoftheappliedstressinnewtons(N)atthepointoffailureshouldbeprovidedbyequipmentcapableofmeasuringstressesuptoandincluding100mNwithanaccuracyof±2,5mN,stressesbetween100mNand500mNwithanaccuracyof±5mN,andstressesexceeding500mNwithanaccuracyof±2,5%oftheindicatedvalue.Thistestisintendedtobeappliedtothewire-to-diebond,wire-to-substratebond,orthewire-to-terminalbondinsidethepackageofwire-connectedsemiconductordevicesbondedbysoldering,thermocompression,ultrasonicandotherrelatedtechniques.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:24P;A4
【正文语种】:英语
【原文标准名称】:半导体器件.机械和气候试验方法.粘接强度
【标准号】:BSEN60749-22-2003
【标准状态】:现行
【国别】:英国
【发布日期】:2003-07-04
【实施或试行日期】:2003-07-04
【发布单位】:英国标准学会(BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:机械试验;电气工程;电子设备及元件;电子工程;试验;粘结强度;半导体;元部件;环境试验;半导体器件;气候试验;集成电路
【英文主题词】:
【摘要】:ThispartofIEC60749isapplicabletosemiconductordevices(discretedevicesandintegratedcircuits).Theobjectofthispartistomeasurebondstrengthordeterminecompliancewithspecifiedbondstrengthrequirements.NOTEThistestisidenticaltothetestmethodcontainedinclause6ofchapter2ofIEC60749(1996),amendment1,apartfromchangestothisclauseandrenumbering.1GeneraldescriptionofthetestSeventestmethodsaredescribed,eachhavingitsownpurpose,thatis:-methodsAandBareintendedfortestinginternalbondsofadevicebyadirectpullingoftheconnectingwire;-methodCisintendedforbondsexternaltothedeviceandconsistsofapeelingstressexertedbetweentheleadorterminalandtheboardorsubstrate;-methodDisintendedforinternalbondsandconsistsofashearstressappliedbetweenadieandasubstrateorsimilarface-bondedconfigurations;-methodsEandFareintendedforexternalbondsandconsistofapush-offorapull-offstressexertedbetweenadieandthesubstrate;-methodGisintendedtotestthemechanicalresistanceofwirebondstoashearforce.2Descriptionofthetestapparatus(forallmethods)Theapparatusforthistestshouldconsistofsuitableequipmentforapplyingthespecifiedstressonthebond,leadwireorterminalsasrequiredinthespecifiedtestmethod.Acalibratedmeasurementandindicationoftheappliedstressinnewtons(N)atthepointoffailureshouldbeprovidedbyequipmentcapableofmeasuringstressesuptoandincluding100mNwithanaccuracyof±2,5mN,stressesbetween100mNand500mNwithanaccuracyof±5mN,andstressesexceeding500mNwithanaccuracyof±2,5%oftheindicatedvalue.Thistestisintendedtobeappliedtothewire-to-diebond,wire-to-substratebond,orthewire-to-terminalbondinsidethepackageofwire-connectedsemiconductordevicesbondedbysoldering,thermocompression,ultrasonicandotherrelatedtechniques.
【中国标准分类号】:L40
【国际标准分类号】:31_080_01
【页数】:24P;A4
【正文语种】:英语
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